傅勝利 校長 :::
	【任期】：民國79年~民國100年8月(1990-2011/8) 　【學歷】：國立成功大學電機工程博士(1977) 　【研究領域】：電子構裝技術、厚膜混成微電子、電子研究、 　　　　　　　　　電子材料

　【重要經歷】：
　　義守大學 講座教授(2001 ~迄今)
　　澳洲南天大學 執行董事(2014 ∼迄今)
　　輔英科技大學 董事(2012 ∼迄今)
　　義联集團材料研究發展委員會 主任委員(2011∼2012)
　　義守大學(含高雄工學院) 校長(1990 ~2011/8)
　　中國青年救國團高雄縣團委會 主任委員(1990)
　　國科會工程科技推展中心 主任(1989-1990)
　　國立成功大學 訓導長(1987~1989)
　　國立成功大學電機工程系所 教授(1982~1990)
　　中華民國青年友好訪問團美西團 領隊(1986)

　【重要建樹】：
　　一、 本校79年獲教育部核定成立高雄工學院，經過不斷努力，在教學、研究、行政方面都有卓越的表現，於86年8月經教育部
　　　　核定升格並更名為「義守大學」。
　　二、 學院(系)設立：由最初高雄工學院的7個系所，發展至電資、理工、管理、傳播與設計、國際、觀光餐旅、語文及醫學院
　　　　等8個學院，40個學系。
　　三、 帶領本校通過民國100年校務評鑑五項全數通過；100年大學校園環境調查暨績效評鑑「特優」；「大專校院校園保護智慧
　　　　財產權評鑑」績優；98年義大就獲選為教育部13所綠色大學示範學校之一等多項殊榮。
　　四、 設立「學海獎學金」獎勵優秀同學赴美國、英國、及澳洲著名大學進修語言及交流； 設立「學文獎學金」鼓勵優秀同學
　　　　赴大陸重點大學交流，更提出「鷹揚計畫」提供優秀同學赴美進修全額獎學金，奠定本校國際化之基礎。
　　五、 在董事會支持之下，設立「慈恩助學金」協助清寒及照顧弱勢同學；並與義联集團各關係企業合作「第一哩計畫」－保證
　　　　就業方案，“入學即就業”，為企業推薦人才，並協助優秀同學就業。

【學術研究】：
(1).2009-2014著作表
(A)期刊論文

1. Shen-Li Fu, Hsiang-Chen Hsu(corresponding author), Yue-Min Wan1, Chi-Hau Haung, “Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads,” Key Engineering Materials,Vol.573 (2014) pp 1-7 (EI).
2. Shen-Li Fu, Chi-Shiung His, Chun-Yueh Kang, Hua-Pin Chen, and Siou-Jyun Wang, “Investigations of Lead-Free Glasses for Post-fired and Embedded Thick Film Resistors”, Key Engineering Materials, Vol.573(2014)pp137-142(EI)
3. Hsiang-Chen Hsu, Li-Ming Chu, Wei-Yao Chang, Yi-Feng Chen, Jih-Hsin Chien, Shen-Li Fu, Shin-Pon Ju, Wen-Jui Feng,” Further Characterization of Pd-coated Copper Wire on Wirebonding Process - from a nanoscale perspective,” Journal of Materials Science: Materials in Electronics, DOI 10.1007/s 10854-013-1290-3, May 2013, (SCI).
4. I-Lin Fu, Yuangshan Chuang, Shen-Li Fu, Robert Beasley, “Implementing Cloud Technology of NETPAW at I-Shou University”, APAMALL Journal of Language Learning Technologies, (2012) Vol.2, No.1, pp91-120 (ISSN:2075-3675)
5. Chung-Ming Wu, Shui-Hsiang Su, Hong-Tai Wang, Meiso Yokoyama, Shen-Li Fu, "Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates", Japanese Journal of Applied Physics, vol. 50, no. 4, pp. 04DK23 1-5, 2011.04
6. Chung-Ming Wu , Shui-Hsiang Su, Hong-Tai Wang, Meiso Yokoyama, Shen-Li Fu, "Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates", Japanese Journal of Applied Physics, vol. 61, pp. 04DK12, 2011.11
7. Hsiang-Chen Hsu, Li-Ming Chu, Shen-Li Fu, "Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor", Advanced Science Letter, vol. 4, pp. 1981-1987, 2011.06
8. Chih-Feng Wang, Wei-Yan Chen, Huy-Zu Cheng, Shen-Li Fu, "Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings", Journal of Physical Chemistry C, vol. 114, no. 37, pp. 15607-15611, 2010.09
9. Hsiang-Chen Hsu, Li-Ming Chu, Lih-Shan Chen, Shen-Li Fu,"Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor", Key Engineering Materials, vol. 419, no. 1, pp. 493-496, 2010.01
10. Ching-Mai Ko, Ming-Kun Chen, Yu-Jung Huang, Shen-Li Fu,"Testing the Reliability of BGAs", SMT Surface Mount Technology Magazine, vol. 23, no. 4, pp. 13, 2009.07
11. Hsiang HI, Hsi CS, Huang CC, Shen-Li Fu, "Low temperature sintering and dielectric properties of BaTiO3 with glass addition", Materials Chemistry and Physics, vol. 113, pp. 658-663, 2009.02

1. H.C. Hsu, J.H. Chien, L.M. Chu, S.P. Ju, Y.T. Feng, Shen-Li Fu, "An Investigation on Nanoscale Tensile Mechanical Properties for Pd-coated Copper Wire", 2013 International Conference on Electronics Packaging (2013 ICEP), Osaka, Japan, 2013.04
2. H.C. Hsu, L.M. Chu, J.H. Chien, C.Y. Wang, Shen-Li Fu, M.S. Bair, "Nanoscale Interfacial Frictional Behavior on Copper-Aluminum Intermetallic Compound", 2013 International Conference on Electronics Packaging (2013 ICEP), Osaka, Japan, 2013.04
3. Hsiang-Chen Hsu, Jih-Hsin Chien, Li-Ming Chu, Shin-Pon Ju, Yu-Ting Feng, Shen-Li Fu, "Nanoscale Bondability Study on Copper-Aluminum Intermetallic Compound Using Molecular Dynamics Simulation",2012 IMPACT International Conference, Taipei, October 23, 2012.
4. Shen-Li Fu, W.C. Lo, H.C. Hsu, “Electronics Packaging Technology Research and Development in Taiwan”, ICEP-IAAC 2012, 2012. 04
5. Shen-Li Fu, W.C. Lo & R.L. Yang, “The Perspectives of 3D IC Technology in Taiwan”, 2012 Pan Pacific Microelectronics Symposium, Kauai, Hawaii, 2012.02
6. Hsiang-Chen Hsu, Jih-Hsin Chien, Chen-Yi Wang, Cheng-Che Liu, Shen-Li Fu, Miin Shyan Bair, "An Investigation on Secondary EFO Copper Wire – from a Nanoscale Perspective View", 14th International Conference on Electronic Materials and Packaging (2012 EMAP), Hong Kong, 2012.12
7. Chi-Yen Shen, Ke-Nung Huang, Shih-Han Wang, Jian-Jhong Chen, Shen-Li Fu, "Determination of Alpha-fetoprotein Using An Acoustic Wave Immunosensor," 2012 World Congress on Medical Physics and Biomedical Engineering, Beijing, China, 2012.05
8. Hsiang-Min Huang, Ke-Nung Huang, Shih-Han Wang, Jian-Jhong Chen, Chi-Yen Shen, Shen-Li Fu, "Detection of Alpha-Fetoprotein Using A Quartz Crystal Microbalance," 9th Asian Conference on Chemical Sensors , Taipei, Taiwan, 2011.11
9. Ke-Nung Huang, Shih-Han Wang, Jian-Jhong Chen, Chi-Yen Shen, Shen-Li Fu, "A QCM-based Measurement System for Alfa-fetoprotein Detection," 2011 Symposium on Engineering, Medicine and Biology Applications, Kaohsiung, Taiwan, 2011.07
10. 沈季燕、黃克穠、王詩涵、陳建仲、黃昱峰、黃詳閔、傅勝利, "Detection of biomarkers of osteoarthritis by using electrochemical quartz crystal microbalance," 2011國際臨床工程及醫學資訊研討會暨國科會醫學工程學門成果發表會, 台南, 台灣, 2011.12
11. 楊佳郡、 施易呈、 沈季燕、 黃克穠、 王詩涵、 洪志勳、 傅勝利, "電化學式退化性關節炎檢免疫感測器," 第十六屆生化工程研討會, 台北, 台灣, 2011.06
12. Shen-Li Fu, Y.S. Chuang, Robert Beasley, “NTU’s Ranking the Best in Asia’s Universities and ISU’s NETPAW Based on Cloud Technology”, ROCMELIA 2011, 2011.12
13. Hsiang-Chen Hsu, Hong-Shen Chang, Shu-Chi Tsao, Shen-Li Fu, "Advanced Finite Element Model on Copper Wire Ball Bonding", 34th International Electronics Manufacturing Technology, Malacca, Malaysia, 2010.12
14. Hsiang-Chen Hsu, Chih-Chiang Fu, Hong-Shen Chang, Shen-Li Fu, Huang-Kuang Kung, "Thermal Aging Effect on Copper Wire and Micro Interfacial Frictional Behavior along Cu FAB and Al Pad", International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2010, Taipei, Taiwan, 2010.10
15. Hung-Ming Chang, Meng-Lun Wu, Lih-Shan Chen, Yu-Jung Huang, Shen-Li Fu, "Study of High Dielectric Constant Capacitors on Flexible Substrates", IMPACT 2010, Taipei Nangang Exhibition Hall, Taiwan, 2010.10
16. S.H. Haung, P. Y. Lu, C.L Chung, Shen-Li Fu, "Preparation of Active Layer of Solar Cells Device by F8T2 (poly [9,9’-dioctyl-fluorene-co-bithiophene]) Blending with PCBM([6,6]-phenyl-C61-butyric acid methyl ester)", Institute of Electrical and Electronics Engineers CPMT Symposium Japan (ICST), Japan, 2010.08
17. Hsiang-Chen Hsu, Jie-Rong Lu, Yue-Min Wan, Shen-Li Fu, "Reliability Analysis on Electromigration and Electro-Thermo-Mechanical for Sn4.0Ag0.5Cu Solder Ball", 2010 International Conference on Electronic Packaging Technology & High Density Packaging (IECPT-HDP), Xian, China, 2010.08
18. Huy-Zu Cheng, Lien-Cheng Kao, Han-Yueh Yang, Shui-Hsiang Su, Shen-Li Fu, Mesio Yokoyama, "Highly Efficient Red Phosphorescent Organic Light-Emitting Diodes Based on PVK Host Doped Ruthenium (Ⅱ) Complex Polymers", The 6th International Symposium on Organic Molecular Electronics (ISOME2010), Chiba University, Chiba, Japan, 2010.06
19. Z.Y Ke, H.C. Chen, C.L. Chung, Shen-Li Fu, Chun-Yao Ou, "Solvents Effect on Morphology and Structure of Semi-conductive Poly (9-9-di-n-octyl-2 7-fluorene) (PFO) Film", International Conference on Electronics Packaging( ICEP), Japan, 2010.05
20. Hsiang-Chen Hsu, Feng-Jui Hsu, Shen-Li Fu, Huang-Kuang Kung, "Hygro-Thermo-Vapor Pressure Coupled Design on MEMS-Based Pressure Sensor", 11th Electronic Material and Packaging Conference (EMAP 2009), Malaysia, 2009.12
21. Ching-Mai Ko, Yu-Jung Huang, Shen-Li Fu, "Floor Plan Design for 3D Multi-Layer Substrate", IMPACT 2009, Taipei Nangang Exhibition Hall, Taiwan, 2009.10
22. Hsiang-Chen Hsu, Shen-Wen Ju, Jie-Rong Lu, Shen-Li Fu, "Electro-thermo-mechanical Design and Electromigration Analysis for Package-on-Package (POP)", 4th IMPACT International Conference, Taipei, Taiwan, 2009.10
23. C.L. Chung, C.W. Ku, H.C. Hsu, Shen-Li Fu, "Comparison between Die Attach Film (DAF) and Film over Wire (FOW) on Stach-die CSP Application", EMPC, Italy, 2009.06
24. S.H. Huang, H.C. Chen, C.L. Chung, Shen-Li Fu, S.C. Ho, A.H. Liu, Y.J. Lee, "Evaluating the Performance of Thermalsetting Resins UnderUltrsonic Bonding Process", ICEP 2009, Kyoto, Japan, 2009.04
25. B.Y. Su, S.C. Chen, Mark Chung, Shen-Li Fu and C.Y. Ou, "Effects of Cold Crystallization on Morphology and Thermal Characteristic of Poly (9,9-di-n-octyl-2,7-fluorene) (PFO)", ICEP2009, Kyoto, Japan, 2009.04
26. Yu-Jung Huang, Ming-Kun Chen, Shen-Li Fu, "Socket Reliability of Hight-speed BGA Packages", Pan Pacific Microelectronics Symposium, Big Island of Hawaii, USA, 2009.02